- Laser Equipment Parts[2]
- Bending Machinery[10]
- Mazut[2]
- Metal Processing Machinery Parts[1]
- Packaging Machinery[3]
- Other Machinery[2]
- Other Used Machinery[1]
- Educational Toys[1]
- Other Metal Processing Machinery[2]
- Machinery Design Services[1]
- Other Service Equipment[1]
- Laser Equipment[2]
- Post-Press Equipment[3]
- Contact Person : Ms. Fang Janet
- Company Name : Huazhengyuan CNC Mechanical & Electrical Equipment Co., Ltd.
- Tel : 86-0755-13725595494
- Fax : 86-0755-33678623
- Address : Guangdong,Shenzhen,2/F-B, 21 Building, Hongtian Road, Shajing Street, Bao'an District
- Country/Region : China
- Zip : 518104
LED bonder
technical parameter
windowsXP Computer system
Operation surface:English surface
300MSEC Working cycle:300MSEC
±5° Angle accuracy :±5°
±1.5mil Position accuracy : ±1.5mil
6mil*6mil~ 100mil*100mil :Wafer Size: 6mil*6mil~ 100mil*100mil
LED,SMD,PCB
Application holder:LED,SMD ,PCB ,dot matrix, Piranha LED and high-power
Double vision system : Precise and adjustable wafer image recognition positioning system
220V±10V,50HZ Power supplier
1.3KW Max power consumption
3-5kgf/cm2 air resource
-80~-90Kpa vacuum
other function and configuration
Leak wafer detection and self-clean suction nozzle
Storage of limitless program
17 inch LCD
external vacuum system
Bonder system
Bonder head
Bonder arm
20G-210G Bonder strength
Wafer XY working size
6″*6″(152mm*152mm)Max route
±0.3mil accuracy
±0.2mil retest accuracy
6″or 4″Wafer size
4mm thimble route
Bonder size 250MM*152MM
10″*6″Max XY route
250MM*152MM
±0.3mil Accuracy
±0.2mil repeatablebility
30degree Bonder arm
LED bonder